IPC-2152 Formula:
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The IPC-2152 standard provides guidelines for determining the current carrying capacity of printed circuit board traces based on their width, thickness, and allowable temperature rise.
The calculator uses the IPC-2152 formula:
Where:
Explanation: The equation accounts for the relationship between trace dimensions, temperature rise, and current carrying capacity.
Details: Proper trace sizing is crucial for PCB reliability, preventing overheating, and ensuring signal integrity in electronic circuits.
Tips: Enter trace width in mils (1 mil = 0.001 inch), copper thickness in ounces (1 oz = 1.37 mils), and desired temperature rise in °C. All values must be positive numbers.
Q1: What's the difference between internal and external traces?
A: External traces (on outer layers) can dissipate heat better than internal traces, hence can carry more current for the same dimensions.
Q2: How does copper thickness affect current capacity?
A: Thicker copper (2oz, 3oz) increases current capacity proportionally, but may require adjustments in PCB manufacturing processes.
Q3: What's a typical temperature rise limit?
A: Common limits are 10°C for general applications, 20°C for most designs, and up to 30°C for high-current applications.
Q4: Are there limitations to this calculation?
A: This is for DC or low-frequency AC. High-frequency effects (skin effect) require additional considerations.
Q5: Should I add safety margins?
A: Yes, it's recommended to derate by 20-50% depending on application criticality and environmental factors.